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Also launches BrewerBUILD material for RDL-First fan-out packaging.
September 5, 2018
By: DAVID SAVASTANO
Editor, Ink World Magazine
Brewer Science, Inc. introduced the latest additions to its BrewerBOND family of temporary bonding materials, as well as the first product in its new BrewerBUILD line of thin spin-on packaging materials, during from SEMICON Taiwan 2018. BrewerBUILD delivers an industry-first solution to address manufacturers’ evolving wafer-level packaging challenges. The BrewerBOND T1100 and BrewerBOND C1300 series combine to create Brewer Science’s first complete, dual-layer system for temporary bonding an...
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